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3D X-ray observation device - List of Manufacturers, Suppliers, Companies and Products

3D X-ray observation device Product List

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3D X-ray observation device 'FX-300tRX2 with CT'

3D X-ray observation device 'FX-300tRX2 with CT'

A compact sealed tube X-ray device that achieves a geometric magnification of 1,000 times! You can reduce inspection costs.

In conventional X-ray inspections, the chip components on the backside became noise components, making accurate inspections difficult. By using the "X-ray stereo method" developed by I-BIT, it has become possible to cancel out chip components mounted on the backside, such as BGA, LGA, and QFN. In this product, unlike conventional X-ray CT methods, it does not require tomographic images, allowing for high-speed processing. 【Features】 ■ Adoption of X-ray stereo method (our proprietary technology) ■ Achieved geometric magnification of 1,000 times ■ Equipped with chip counter function ■ High-magnification oblique shooting possible with wide-angle X-ray irradiation ■ Measurement of solder rise (solder filling rate) in through-holes is possible *New feature ■ Automatic BGA inspection function (optional) ■ VCT (Vertical CT) and PCT (Oblique CT) functions (optional) *For more details, please refer to the PDF document or feel free to contact us.

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Large substrate compatible 3D X-ray observation device 'FX-300tRX LL'

Large substrate compatible 3D X-ray observation device 'FX-300tRX LL'

Achieved a geometric magnification of 1,000 times! This is an X-ray observation device capable of accommodating substrate sizes up to 600×600mm.

This product is a three-dimensional X-ray observation device compatible with large substrates. It allows real-time X-ray observation by penetrating X-rays through the invisible parts of the inspection target. It is suitable for observing large printed circuit boards and large mounted substrates. It covers the entire area of a substrate size of 600×600mm and achieves a geometric magnification of 1,000 times. With the X-ray stereo method, it is possible to observe by removing the mounted components on the back side. 【Features】 - Covers the entire area of a substrate size of 600×600mm - Achieves a geometric magnification of 1,000 times - The X-ray camera can be tilted to any angle from 0 to 60° - Improved operability with a touch panel and joystick - Large samples can be easily set with a sliding door - The turntable can accommodate substrates up to 400×400mm (optional) *For more details, please refer to the PDF document or feel free to contact us.

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3D X-ray observation device FX-300 tRX2/LL with CT

3D X-ray observation device FX-300 tRX2/LL with CT

Support for large substrates up to 600×600mm is also possible! A compact sealed tube type X-ray device that achieves a geometric magnification of 1,000 times.

The "FX-300 tRX2/LL with CT" is a three-dimensional X-ray observation device that employs X-ray stereo technology. It is capable of canceling chip components mounted on the underside of BGA, LGA, QFN, etc. Additionally, a convenient chip counter function (capable of counting quantities in reel state) is now standard. 【Features】 ■ Adopts X-ray stereo technology (unique technology by Ibit) ■ Achieves a geometric magnification of 1,000 times ■ Equipped with a chip counter function ■ High-magnification oblique shooting possible with wide-angle X-ray irradiation ■ An LL model compatible with large substrates of 600×600mm is also available *For more details, please refer to the PDF document or feel free to contact us.

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3D X-ray observation device that supports X-ray inspection and chip component counting with one unit.

3D X-ray observation device that supports X-ray inspection and chip component counting with one unit.

Equipped with a 1,000 times high-magnification X-ray inspection machine and a convenient chip counter as standard. It can count the quantity of electronic components in about 30 seconds.

The "FX-300 tRX2 with CT" is a three-dimensional X-ray observation device that can inspect the chip components on the underside of a circuit board by canceling them out using its unique "X-ray stereo method." It also comes standard with a chip counter function, allowing it to count the quantity of electronic components such as square chips, ICs, and LEDs in reel form in approximately 20 to 30 seconds. This product supports dual functions for "inspection of BGA, LGA, QFN, etc." and "counting the number of chip components" at a reasonable price. 【Features】 ■ Geometric magnification of 1,000 times ■ Compact sealed tube type ■ Capable of diagonal shooting at high magnification ■ The LL model supports large circuit boards of 600×600mm ■ Optional features such as automatic BGA inspection, vertical CT, and diagonal CT can also be added *For more details, please refer to the PDF document or feel free to contact us.

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X-ray stereo method 3D X-ray observation device 'FX-500tRX2-LL'

X-ray stereo method 3D X-ray observation device 'FX-500tRX2-LL'

Successfully inherited all functions of the FX-tRX series and achieved larger size!

The "FX-500tRX2-LL" is an X-ray stereo method 3D X-ray observation device that supports large substrates of 700×600mm. With its unique "X-ray stereo method," it cancels the backside of mounted substrates. The further evolved "X-ray stereo CT method" allows for slicing the mounted substrate into 500 layers. For 600×600mm substrates, there are no restrictions on the CT imaging area with "anywhere CT." The X-ray output/X-ray resolution is 130kV, 300μA, 39W/4μm. 【Features】 ■ 2D transmission, diagonal 60-degree observation: 700×600mm ■ 3D X-ray stereo CT observation: 600×600mm ■ Geometric magnification: minimum 1.4x to maximum 2000x ■ 3D X-ray V-CT compatible (vertical CT) ■ 3D X-ray P-CT compatible (diagonal CT) ■ Through-hole solder filling rate measurement *For more details, please download the PDF or feel free to contact us.

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